| 摘要 |
<p>A process is described for manufacturing through-hole plated single-layer or multi-layer printed circuit boards based on a polymeric substrate material or on a ceramic material provided optionally on both sides with at least one electroconductive layer by electroplating or electroless plating with a metal layer also on those surfaces which have not been coated with a conductive metal layer, said process being characterized in that a) the surfaces of the substrate are pre-treated in a solution having oxidizing activity, b) after removal of the residual solution by rinsing, the substrate is introduced into a solution which contains at least one monomer, and more specifically pyrrole, furane, thiophene or derivative(s) thereof, which in a polymeric or copolymeric form is electrically conductive, c) the substrate is then transferred into an acidic solution whereby an electrically conductive polymeric layer, more specifically of polymerized or copolymerized pyrrole, furane, thiophene or derivative(s) thereof, whereupon, if desired or required, any residual solution is removed by rinsing, and the galvanic or electroless metallization is carried out.</p> |
