| 摘要 |
<p>PURPOSE:To secure connection and improve reliability of adhesion even at high temperature by performing silver plating to an electrode plate connected by a conductive adhesive. CONSTITUTION:Electrode plates 9a and 9b which are connected to a varister 6 with electrodes 7a and 7b on the front and rear surfaces by conductive adhesives 8a and 8b become the silver plating electrode plates. Since the adhesion part of electrode plates 9a and 9b are silver plate parts 10a and 10, no plating film fluxes. It allows the connection to be secured even at a high temperature and adhesion reliability to be improved.</p> |
