Handling device

摘要

In the case of a handling device, in particular for wafers, having a gripper (1) which can be moved in one plane between at least two working positions via a linkage (6), in order to achieve a compact design at little constructional cost and in order to optimise the positioning accuracy, it is proposed that the linkage (6) has at least two legs (3, 4, 3', 4') which are coupled to one another via a joint, and that the free end of the one leg (3, 3') is fixed on a drive shaft (8, 8') so as to be pivotable through approximately 180@, that the free end of the other leg (4, 4') bears the gripper (1) via a further joint, and that the two legs (3, 4, 3', 4') coupled to one another are coupled to one another via a mechanism (5, 5') in such a way that the pivoting angle, corresponding to the angle of rotation of the drive shaft (8, 8'), of the one leg (3, 3') relative to the gripper (1) is of the same size but opposite to the pivoting angle of the other leg (4, 4') relative to the gripper (1). <IMAGE>