发明名称 Kühlelement für eine Halbleitervorrichtung
摘要 1316086 Semi-conductor devices REDPOINT Ltd 1 July 1970 [1 July 1969] 33279/69 Heading H1K A heat sink for a dual in line rectangular semi-conductor device 1 having plural lead pairs 2 comprises a radiative aluminium trough 3 with a symmetrical longitudinal slot 4 in its web covering and contacting the surface of the device 1, which is retained by a longitudinally supporting bar 5 of insulated aluminium, which is anchored by resilient clips 8, engaging slots of the bar and shaped detents of trough 3. Alternatively (Fig. 3 not shown), the trough may have longitudinally extending fins, and the clip may be of resilient e.g. nylon plastic (Fig. 4 not shown) engaging the web surface of the trough without detents. A further modification (Fig. 5), comprises rectangular aluminium body 13 with fins in its upper surface and a shaped recess on its underside receiving and contacting the semi-conductor device, which is retained by a flat aluminium corner bar 15 insulated by sleeving or coating and extended as rectangular rods to form a U; the rods traversing holes 16 in body 13 and resilient silicone eyeletted bushes 16 and being bent over. In a further modification (Figs. 7, 8, 9 not shown), an all-round retaining strap of U-shape retains the semi-conductor by underlying, insulated lugs at its ends; struck-out resilient arms within the web of the U engaging recesses in the surface of the heat sink body.
申请公布号 CH510327(A) 申请公布日期 1971.07.15
申请号 CH19700009962 申请日期 1970.07.01
申请人 REDPOINT LIMITED 发明人 HOPKINS,FRANK
分类号 H01L23/40;(IPC1-7):H01L1/12 主分类号 H01L23/40
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