发明名称 |
Semiconductor substrate comprising wafer substrate and compound semiconductor layer. |
摘要 |
<p>A semiconductor substrate including a top epitaxial compound layer comprising: a single-crystalline semiconductor wafer substrate (11); a strained layer superlattice (SLS) structure layer (12) having a lattice constant varying from that of the wafer substrate (11) to that of the top compound semiconductor layer (15) and formed on the wafer substrate (11); a semiconductor buffer layer (13) having the same lattice constant as that of the top compound semiconductor layer (15) and formed on the SLS structure layer (12); another SLS structure layer (14) for filtering dislocations having a fixed lattice constant equal to that of the top semiconductor layer (15) and formed on the buffer layer (13); and the top semiconductor layer (15) formed on the another SLS structure layer (14).</p> |
申请公布号 |
EP0331433(A1) |
申请公布日期 |
1989.09.06 |
申请号 |
EP19890301981 |
申请日期 |
1989.02.28 |
申请人 |
FUJITSU LIMITED |
发明人 |
OKUDA, HIROSHI |
分类号 |
H01L21/20;H01L29/15;H01L29/267 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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