发明名称 Semiconductor substrate comprising wafer substrate and compound semiconductor layer.
摘要 <p>A semiconductor substrate including a top epitaxial compound layer comprising: a single-crystalline semiconductor wafer substrate (11); a strained layer superlattice (SLS) structure layer (12) having a lattice constant varying from that of the wafer substrate (11) to that of the top compound semiconductor layer (15) and formed on the wafer substrate (11); a semiconductor buffer layer (13) having the same lattice constant as that of the top compound semiconductor layer (15) and formed on the SLS structure layer (12); another SLS structure layer (14) for filtering dislocations having a fixed lattice constant equal to that of the top semiconductor layer (15) and formed on the buffer layer (13); and the top semiconductor layer (15) formed on the another SLS structure layer (14).</p>
申请公布号 EP0331433(A1) 申请公布日期 1989.09.06
申请号 EP19890301981 申请日期 1989.02.28
申请人 FUJITSU LIMITED 发明人 OKUDA, HIROSHI
分类号 H01L21/20;H01L29/15;H01L29/267 主分类号 H01L21/20
代理机构 代理人
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