| 摘要 |
PURPOSE:To reduce the output of a light source, and also, to miniaturize and thin a packaging body by providing an electrode on the reverse side of a substrate on which an electronic device is formed, and attaching an LED chip to this electrode as one body with the substrate. CONSTITUTION:On the surface side of a substrate 1 made of transparent glass, liquid crystal elements 2 such as a liquid crystal display an a liquid crystal shutter, etc. are formed. On the other hand, on the reverse side of the substrate 1, an electrode 8 is provided, and to this electrode, an LED chip 7 is connected by a bump 10 and a solder bump 11 by a face-down bonding method. An emitted light 12 of the LED chip 7 transmits through the substrate 1 from the reverse side of the substrate 1 and irradiates the liquid crystal elements 2. Accordingly, by shortening a distance between the LED chip 7 being in irradiation light source and the surface to be irradiated by the beam the output of the light source is reduced, and also, since the chip 7 is provided as one body on the reverse side of the substrate, a packaging body can be miniaturized and thinned. |
