发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To improve adhesion to a metal and the removability of a hardened resist with an alkali removing soln. by using a photosensitive resin compsn. consisting of a base polymer, a specified photopolymerizable monomer and a photopolymn. initiator. CONSTITUTION:In a compsn. consisting of a base polymer (A), a photopolymerizable monomer (B) and a photopolymn. initiator (C), an ethylenic unsatd. compd. (b) contg. an acetoacetyl group is incorporated into at least a part of the monomer B. The pref. content is 1-100wt.%, especially 5-40wt.%. The base polymer A is preferably acrylic resin and the resin is copolymerized with about 15-30wt.% ethylenic unsatd. carboxylic acid when the compsn. is made developable with dil. alkali. The pref. amt. of the monomer B is 5-150 pts.wt., especially 40-100pts.wt. per 100pts.wt. polymer A.
申请公布号 JPH01219733(A) 申请公布日期 1989.09.01
申请号 JP19880045502 申请日期 1988.02.27
申请人 NIPPON SYNTHETIC CHEM IND CO LTD:THE 发明人 ODA MICHIO;AKIYAMA MAMORU
分类号 G03F7/004;G03F7/027;G03F7/033;H05K3/06 主分类号 G03F7/004
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