首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
摘要
申请公布号
JPH01127866(U)
申请公布日期
1989.08.31
申请号
JP19880023061U
申请日期
1988.02.25
申请人
发明人
分类号
B41L13/02;(IPC1-7):B41L13/02
主分类号
B41L13/02
代理机构
代理人
主权项
地址
您可能感兴趣的专利
STRUCTURES FOR WAFER LEVEL TEST AND BURN-IN
ELECTRICAL CONNECTOR MATEABLE IN A PLURALITY OF ORIENTATIONS
A METHOD OF FABRICATING A SEMICONDUCTOR STRUCTURE HAVING QUANTUM WIRES AND A SEMICONDUCTOR DEVICE INCLUDING SUCH STRUCTURE
CONNECTOR HAVING PRESS FIT TYPE CONTACTS
HIGH COERCIVITY COBALT BASED ALLOY LONGITUDINAL RECORDING MEDIA AND METHOD FOR ITS FABRICATION
MAGNETIC HEAD APPARATUS WITH HEAD IC CHIP
A METHOD AND APPARATUS FOR PREVENTING THE OCCURENCE OF FALSE RESPONSES IN OPTICAL DETECTION DEVICES
A METHOD OF CHROMATOGRAPHIC ISOLATION FOR NON-GLYCERIDE COMPONENTS
Portable information terminal with second display which folds out from back of case
CLIP FOR MOUNTING OBJECTS ON A WALL STUD
SEMICONDUCTOR PACKAGE HAVING SUBSTRATE WITH MULTI-LAYER METAL BUMPS
CONTROL VARIABLES
OSCILLOSCOPE PANEL CAPTURE AND IMPLEMENTATION
An electro-optically tunable optical filter
Wake up device
Pinch roller apparatus
LAPPING OIL COMPOSITION FOR FINISH-GRINDING
CHIP SCALE SURFACE MOUNT PACKAGE FOR SEMICONDUCTOR DEVICE AND PROCESS OF FABRICATING THE SAME
DISK DRIVE INCLUDING PERPENDICULAR MAGNETIC RECORDING SYSTEM WITH WRITE COMPENSATION
INTERPOSER ASSEMBLY