| 摘要 |
PURPOSE:To enhance a heat-resistant property by a method wherein a lead frame is formed by installing an aluminum nitride layer between a substrate and an aluminum layer in order to prevent iron on the substrate from being diffused to the aluminum layer even at a high temperature. CONSTITUTION:An aluminum nitride layer 12 is formed on a substrate 11 of an iron-nickel alloy or an iron-cobalt-nickel alloy; an aluminum layer 13 is formed on the aluminum layer 12; an aluminum-evaporated lead frame 1 is obtained. The aluminum layer 12 is within a range of 0.1-1.5mum. A substance containing nickel or cobalt is contained in the aluminum layer 12. By this setup, iron on the substrate 11 is not diffused to the aluminum layer 13 even at a high temperature; a heat-resistant property can be enhanced. |
