| 摘要 |
A hot-melt adhesive anisotropic interconnector is in the form of an integral sheet comprising an array of alternately arranged strips (3, 2) of an isotropically-electroconductive hot-melt adhesive resin composition and of an electrically- insulating hot-melt adhesive resin composition; and, on opposite sides of the sheet, layers (4) of an electrically-insulating hot-melt adhesive resin composition. The layers (4) improve the adhesive bonding between two arrays of terminals (13, 16) on two opposing substrates (12, 15) and the electrical connection between the terminals has increased stability against instrusion of ambient moisture by virtue of the layers (4). The interconnector may be square (fig. 7) to connect terminals (22) of an I.C. package (21) with terminals (24) of a p.c.b. (23). <IMAGE> |
