| 摘要 |
A metal film parallel plate capacitor 10 comprises a plurality of layers of dielectric material 21 each carrying a metallic film 23 and arranged in a stack with the metallic film 23 of each layer being separated by dielectric material 21 from the metallic film 23 of an adjacent layer. The capacitor is protected from the environment by a packaging system including wrapping means 16, such as adhesive tape extending around all side faces of the stack of layers. Electrically conductive coatings 14 are applied to and cover end faces of the stack of layers and are connected to the metallic film 23. Preferably electrical leads 18 are connected to the coatings 14 by a plasma impact connection method and this prevents reflow of the electrical lead 18 connections when the capacitor is connected in an electrical circuit. |
