发明名称 Strain-relieved, especially tension-relieved and pressure-relieved soldered connection
摘要 Strain-relieved, especially tension-relieved and pressure-relieved soldered connection (5) between electrical contact layers, especially the conductor tracks of electrical printed circuit boards (1) and connection elements (1) which are fed through printed circuit board holes (3) and belong to electrical components and the like (2) which are arranged on the opposite side of the printed circuit board from the soldered connection (5), the printed circuit board holes (3) being chosen with a diameter which is larger compared to the diameter of the connection elements (1) and the soldered connections (5) being arranged at a distance from the printed circuit board holes (3) and, with always the same size of cross-section, considered in the longitudinal direction of the connection elements, the diameter of the connection elements (4) being reduced at least in one region between the soldered connections (5) and the printed circuit board holes (3), in a direction transverse to the longitudinal direction of the connection elements. <IMAGE>
申请公布号 DE3805121(A1) 申请公布日期 1989.08.31
申请号 DE19883805121 申请日期 1988.02.18
申请人 SIEMENS AG, 1000 BERLIN UND 8000 MUENCHEN, DE 发明人 FETH, JOSEF, 8400 REGENSBURG, DE;DIRMEYER, JOSEF, 8465 BODENWOEHR, DE
分类号 H05K1/02;H05K1/11;H05K3/30;H05K3/34 主分类号 H05K1/02
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