| 摘要 |
PURPOSE:To enable high packaging density and free arrangement of electronic parts and lead pins by forming soldered surfaces on the base ends of the lead pins, and conductively fixing the soldered surfaces onto solder lands formed on the plate of a circuit substrate. CONSTITUTION:The recesses 14b of lead pins 14, 14... are inserted into the lead lands 17, 17... of a first circuit substrate 11 so as to be soldered thereto. Two circuit substrates 11 and 12 are piled up in such a way that the soldered surfaces 14a of the lead pins 14, 14... are abutted against the solder lands 15, 15... of a second circuit substrate 12, and thereat, the soldered surfaces 14a are soldered to the solder lands 15, 15.... This causes the substrate 11 and 12 to be fixed to each other and also their wiring patterns 18 to be electrically connected to each other, thereby providing a one piece hybrid integrated circuit. |
