| 摘要 |
PURPOSE:To improve heat dissipating properties at a low cost, by providing a heat dissipating plate on a wiring board having a base of a resin material. CONSTITUTION:A plurality of semiconductor elements 2 are packaged face-to- face on the surface of a printed wiring board 3 and outer leads 2b of the semiconductor elements 2 are connected with a wiring layer 3a formed of copper or the like on the surface of the printed wiring board 3, by means of solder 4 or the like. The printed wiring board 3 has a base 3b formed of a resin material such as glass epoxy or the like. Further, a heat dissipating plate 5 formed of a metal is adhered or contact bonded to the rear face of the base 3b and the heat dissipating plate 5 is totally covered with an insulating layer 6 of an epoxy resin or the like. |
