Device and method for the controlled feeding of a bonding wire to the wedge or to the capillary of a bonding head

摘要

Device and method for the controlled feeding of a bonding wire (10) to the wedge or to the capillary of a bonding head, having a channel-like bonding wire guide (12) upstream of the wedge or the bonding capillary and into which a connection (15) opens which can optionally be connected to a source of pressurised gas - especially compressed air (13) - or a vacuum source (14), with the result that it is possible to generate around the bonding wire (10) a coaxial flow of gas, especially of air, by means of which the bonding wire (10) can either be pushed or drawn or braked. This device and this method are suitable, in particular, for ball bonding and in the case of the so-called loop formation.