发明名称 Electrically conductive adhesive composition.
摘要 <p>The conducting adhesive mixture consists of conducting particles disposed in a thermoplastic-based material which has no transition between two of its solid states accompanied by an appreciable change in its specific volume at a temperature below 85 DEG C. The mechanical bonds and electrical connections between two sub- assemblies produced using this conducting adhesive mixture can, without damage, withstand storage for 24 hours at +75 DEG C and one hundred cyclic variations of temperature between -55 DEG C and +85 DEG C.</p>
申请公布号 EP0330113(A1) 申请公布日期 1989.08.30
申请号 EP19890102886 申请日期 1989.02.20
申请人 ASULAB S.A. 发明人 COGNARD, JACQUES
分类号 H01B1/22;C09J201/00;C09J11/04;H01B1/20;H01B1/24;H05K3/32;H05K3/36 主分类号 H01B1/22
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