| 摘要 |
Device and method for the controlled supply of a bonding wire, in particular a gold bonding wire (10), to the wedge or to the capillary (22) of a bonding head (21) which can be moved up and down (double arrow 30). The device is characterised by a bonding-wire guide channel (12, 18, 19, 20) which is arranged upstream of the bonding capillary (22) and which has leading into it a fluid connection (15) which can alternatively be connected to a pressure-gas source, in particular a compressed-air source (13), or a vacuum source (14), and in addition preferably by a bonding-wire slip clamp (23) which is allocated to the bonding-wire guide channel (12, 18, 19, 20), is arranged in particular in front of or on the capillary-side end of the same and is effective or closed either permanently or only when lowering the bonding head (21) for "touch-down". Furthermore, a fixed bonding-wire clip (24) can be arranged downstream of the bonding-wire guide channel (12, 18, 19, 20), which bonding-wire clip (24) can be closed or opened as a function of the height of the bonding head (21) with withdrawal and corresponding removal of a bonding-wire section, hanging down out of the capillary tip (26), directly before the second "touch-down". …<IMAGE>… |
