| 摘要 |
<p>PURPOSE:To obtain an adhered state of a whole surface adherence with a small amount of adhering material by coating the surface of a wafer with wax, then inverting and steadily placing it on a preheated surface plate, and eccentrically circularly moving it along the outer periphery of the wafer while pressurizing a press head. CONSTITUTION:A wafer is inverted and placed on a surface plate 3 preheated to approx. 80-120 deg.C, and the wafer 1 is steadily placed at a predetermined position on the plate through a wax film 2. A press head 4 having substantially the same size as the diameter of the wafer is pressed on the rear face of the wafer to pressurize it. Then, the center of the head 4 is displaced by (d) from the center (o) of the wafer, and the push rod 5 of the head 4 is so eccentrically rotatably moved as to move the center (o) of the wafer on a circle having a radius (d) at the center (o) of the wafer as a center. Thus, the operation of eccentrically moving the head and pressing it to the rear face of the wafer is repeated to obtain a completely contact state without air bubble remainder over the whole surface of the wafer.</p> |
