| 摘要 |
PURPOSE:To enhance adhesion between a polyimide film and a photoresist by interposing an interface modifying film made of a specified compound between the film of polyimide or its precursor and the photoresist. CONSTITUTION:The interface improving film made of aluminum alcoholate, such as aluminum isopropylate or monosec-butoxy-aluminum diisopropylate, or aluminum chelate, such as ethyl acetate aluminum diisopropylate or aluminum tris(ethyl acetate), is formed between the film of the polyimide having a low expansion coefficient of <=3X10<-5>K<-1> or its precursor obtained by heating the precursor varnish at <=250 deg.C, and semihardening it and the photoresist of a cyclic rubber type negative photoresist or the like. |
