| 摘要 |
PURPOSE:To change the function of a lead or a wiring simply as required, and to arrange a circuit formed on a semiconductor chip at an optimum position by connecting an external terminal for the semiconductor chip and the lead or the wiring for a substrate for loading the chip while coated wires are made to cross the other coated wires. CONSTITUTION:Coated wires 4 are constituted by coating the surfaces of metallic wires 4A with insulators 4B, and external terminals 2A for a semiconductor chip 2 and inner lead sections 3A are connected partially while the coated wires 4 are crossed with other coated wires 4. The inner lead sections 3A corresponding to the functions of the external terminals 2A are disposed fundamentally near sections where the external terminals 2A are arranged. When the position (a function) of the arrangement of the lead 3 for reference voltage (ground potential GND) and the position (a function) of the arrangement of the lead 3 for supply voltage (the operating potential Vcc of a circuit) are altered, the coated wires 4 are crossed, and connected to each of the external terminal 2A for reference voltage and the external terminal 2A for supply voltage. |
