| 摘要 |
PURPOSE:To obtain a suction apparatus where a nearly uniformly flattening and correcting force is obtained over the whole face of a substrate while the stability and certainty are maintained during an automatic transfer operation of the substrate such as a wafer or the like by a method wherein two or more through holes are made in a stage separately from each other and two or more support members which are inserted individually inserted into the through holes and moved upward and downward are installed. CONSTITUTION:Two or more through holes 10a-10c piercing a mounting face 5 are made separately from each other in a stage where the mounting face 5 whose shape is nearly identical to the external shape of a substrate (W) to be flattened and corrected is contained, protruding parts 50 scattered on the whole face of the mounting face 5 are distributed and formed nearly evenly and the rear of the substrate (W) is sucked by reducing a pressure in recessed parts around the protruding parts 50 by following a reference plane prescribed by the upper face of said two or more protruding parts 50. In order to mount the substrate (W) on said mounting face 5 while its rear is brought into contact with the face and to separate the rear of the substrate (W) from the mounting face 5 by a prescribed amount, the following are installed: two or more support members 14a-14c which are inserted into said through holes 10a-10c and can be moved upward and downward; intake holes which are made at individual upper-end faces of the members and suck the rear of the substrate (W) when the substrate (W) is separated from the mounting face 5. |
