| 摘要 |
PURPOSE:To miniaturize resistors and reduce the size of a chip, by forming a plurality of resistance layers on a semiconductor substrate in such a way that an insulation layer is placed between the resistance layers. CONSTITUTION:A first resistance layer 2a is formed on a semiconductor substrate 4 and an insulation layer 3 is provided on the resistance layer 2a. Then, a second resistance layer 2b is provided on the insulation layer 3 and parts of the insulation layer 3 as well as the resistance layer 2b are removed by etching and the like and then, electrodes 1 are installed respectively. The size of resistance elements is thus reduced and each chip is miniaturized. |
