| 摘要 |
PURPOSE:To obtain a multilayer printed wiring board that can be provided with a conducting hole that connect two sets of conductive layers separately on one lattice point by providing a plated conducting hole that conducts external layers inside a plated conducting hole that connects internal layers. CONSTITUTION:In a multilayer printed wiring board, a plated conducting hole 7 that connects external layers is provided inside a plated conducting hole 3 that connects internal layers. For example, a conducting hole 3 that connects conductive layers 2a, 2b formed on the front and rear surfaces of an internal layer core material 1 is formed larger in size than that of a conventional one and is plated, and a conducting hole 7 that connects conductive layers 5a, 5b formed on the front and rear surfaces of external layer base materials 4a, 4b is formed inside it. A multilayer printed wiring board as above is manufactured as follows. The conducting hole 3 is formed in the internal layer core material 1, then resin 9 is filled in the hole 3. External layer base materials 4a, 4b are laminated via prepreg 8 and hardened. Then, the conducting hole 7 is formed inside the conducting hole 3. |
