| 摘要 |
PURPOSE:To enable lead wires to be coated with a just required amount of flux only on a required part thereof, by dipping only lead wires in the flux before interposing an electronic component element between the lead wires. CONSTITUTION:Each lead wire is provided with grooves 11a so that it an hold flux more securely. Lead wires 11, 12 are dipped in flux 13 contained in a flux tank 14 such that only a part of the lead wires to be brought into contact with an electronic component element 15 is dipped in the flux. In this manner, the part of the lead wires coated with the flux can be limited reliably only to the part thereof to be soldered to the electronic component element. Therefore, required amounts of the flux and the solder an be reduced substantially, while deterioration in properties of the electronic component can be prevented. |
