发明名称 ELECTROLESS PLATING METHOD
摘要 PURPOSE:To carry out electroless plating at a high rate of deposition without deteriorating the physical properties of a deposited metal by stirring a plating soln. with a gas other than oxygen. CONSTITUTION:Electroless plating is carried out while stirring a plating soln. with a gas other than oxygen or a gaseous mixture of a gas other than oxygen with oxygen. A gas such as hydrogen or carbon dioxide is not, however, suitable for the stirring because it deteriorates the physical properties of a deposited metal. By this method, the formation of unnecessary metal particles is inhibited without deteriorating the physical properties of a deposited metal and electroless plating can be carried out at a high rate of deposition.
申请公布号 JPH01212772(A) 申请公布日期 1989.08.25
申请号 JP19880037217 申请日期 1988.02.19
申请人 HITACHI CHEM CO LTD 发明人 SUZUKI KUNIJI;KAMIYAMA KOJI;OUCHI TAKASHI
分类号 C23C18/40;C23C18/16;C23C18/31 主分类号 C23C18/40
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