| 摘要 |
PURPOSE:To provide a circuit connecting conductor to the rear of the part where a semiconductor chip is packaged to enable a highly dense wiring by a method wherein an insulator is filled with and buried in the gap between circuit connecting conductors on the rear of a base material. CONSTITUTION:A hard resin material 11 is filled and buried as an insulator in a part, corresponding to the part where a semiconductor chip 4 is mounted, out of gaps g between wiring parts of circuit connecting conductors 7 provided to the rear of a base material 1. Therefore, a second bonding point 6 is supported on a pad 2 through the intermediary of the resin 11 filled and buried in the gap g between the wiring conductor 7s. Pressure and supersonic vibration energy both applied to a capillary 10 are sufficiently transmitted to the second bonding point 6 to enable a stable bonding. By these processes, wiring conductors can be provided to the rear side of a semiconductor chip mounting part so as to facilitate a highly dense wiring. |
