| 摘要 |
<p>PURPOSE:To shorten a signal conductor and to reduce the ground impedance of the signal conductor to a high-frequency signal by a method wherein a laminated capacitor is formed on the sidewall of a package. CONSTITUTION:An input/output terminal 1 is connected to an IC chip 2 through a signal conductor pattern 4 and a bonding wire 3 and an earth terminal 6 is connected with grounding patterns 7 through through holes 5. The pattern 4 is formed into a structure wherein the signal conductor pattern and the patterns 7 are stacked holding alternately a ceramic 8 between them through the holes 5. Accordingly, a laminated capacitor is formed of the patterns 4 and 7 interposing alternately the dielectric substance (ceramic) 8 between them. As the capacitor is formed at the signal conductor part in the interior of a package in such a way, the ground impedance of this grounding signal conductor to a high-frequency signal can be made low.</p> |
