| 摘要 |
<p>PURPOSE:To form a tray for an integrated circuit into a tray, which is superior in a conductivity, a heat resistance and a mechanical strength, by a method wherein an acrylonitrile-butadinene rubber is used in combination with a resol type phenolic resin and a natural or regenerated fibrous filler and a conductive carbon black are added to a matrix consisting of the resin and the rubber. CONSTITUTION:A phenolic resin molding material obtainable by adding a natural or regenerated fibrous filler 30-45 weight part and a conductive carbon black 30-45 weight part to a matrix 100 weight part consisting of 85-95wt.% of a resol type phenolic resin and 15-5wt.% of an acrylonitrile-butadiene rubber is used and a tray for an integrated circuit and having a surface resistivity of 102-105OMEGA, a specific gravity of 1.45 or lower and a glass transition temperature of 150 deg.C or higher is formed. Thereby, this tray for an IC becomes one which is superior in a heat resistance, an impact resistance and a conductivity and, moreover, is small in a specific gravity and a warpage.</p> |
