发明名称 PACKAGE
摘要 PURPOSE:To facilitate automation of the performance test of an element by a method wherein lead accommodating grooves are formed at the circumference of a package main body at the prescribed intervals, and the edge parts on one side of outer leads are led out therefrom as not to come out from the region surrounded with the outline of the main body. CONSTITUTION:A package main body 10 is formed of epoxy resin, etc., and the lead accommodating grooves 11 are notched at the four side parts thereof at the prescribed intervals. In the grooves 11, the edge parts on one side of the outer leads 12 connected electrically to the element with the edge parts on another side are led out as not to come out from the region surrounded with the outline of the main body 10 at the neighborhood of the main body 10. When such the package 20 is inserted in the accommodating magazine of an automatic package handler and is dropped naturally, the outer leads 12 come not in contact with a guide wall completely, and is transferred quickly to the region to be performed with the performance test.
申请公布号 JPS58184746(A) 申请公布日期 1983.10.28
申请号 JP19820067933 申请日期 1982.04.22
申请人 TOKYO SHIBAURA DENKI KK 发明人 MINAMI KENJI;KATAGIRI MASARU
分类号 H01L23/50;H01L21/00 主分类号 H01L23/50
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