| 摘要 |
<p>A method and a device for dressing an inner peripheral blade (10) used in a slicing machine which slices a silicone ingot (1) or the like into thin wafers. In the method and device, the manner of dressing the inner peripheral blade (10) can be determined from the career of the inner peripheral blade (10), the value of slicing resistance occurring during the slicing of the ingot (1), the amount of displacement of the inner peripheral blade (10) during the ingot (1) slicing, and the shape of the end face of the ingot (1) after slicing of the ingot (1). Based on this determination, a dressing stick (12) provided in the dressing device is driven, so that the inner peripheral blade (10) can be dressed automatically.</p> |
