| 摘要 |
PURPOSE:To suppress damage of wafer and to perform polishing work stably by providing an ejector for spraying polishing agent onto a work such as a polishing cloth or a wafer prior to polishing work thereby reducing vibration during polishing work. CONSTITUTION:An ejector 18 for spraying polishing agent is provided independently from a polishing agent supply means 10 assembled into the body of a polishing device. The ejector 18 sprays polishing agent sufficiently onto the surface of a polishing cloth 9 and a work 3 prior to polishing work. Then upper and lower lathes 1, 2 are lowered to hold the work 3 mounted in a carrier 7 between the lathes 1, 2. Under this state, a solenoid valve 16 in the polishing agent supply means 10 is excited to feed polishing agent through a receiver 12, a tube 15 and a supply port 14 to the polishing cloth 8, the work 3 and the polishing cloth 9 sequentially. Then an inner gear 5 and a sun gear 6 are rotated to rotate the lathes 1, 2 relatively so as to polish the upper and lower faces of the work 3 with low vibration. |
