| 摘要 |
<p>PURPOSE:To ultrasonically clean adhesive adhered to a grindstone and consequently prevent the loading of the grindstone during cutting from occurring and make it possible to prolong the service life of the grindstone by a method wherein ultrasonic vibration is applied to the grindstone of a dicing saw after every end of water cutting in the process of the complete separation reaching an adherent sheet from the surface of a wafer. CONSTITUTION:In the process of the complete separation reaching an adherent sheet from the surface of a wafer, ultrasonic vibration is applied with an ultrasonic vibrator 2 to a grindstone, to which adhesive is adhered, for about one minute ranging from the end of wafer cutting to the start of next wafer cutting and simultaneously the ultrasonic cleaning is done by utilizing pure water 5 jetting from a cleaning nozzle 4. As a result, next wafer cutting can be done by a loading-free grindstone 3.</p> |
