发明名称 PATCH FOR BORING PRINTED BOARD
摘要 PURPOSE:To adhere a patch to a printed board closely to thicken the patch, prolong the drill life, and thus improve the workability by coating one side of the patch with a pressure sensitive adhesive, and providing the other side with a released coat having peeling property with the pressure sensitive adhesive. CONSTITUTION:A patch 1 having a pressure sensitive adhesive 2 on the lower face thereof is placed on a copper coil 5 adhered to a board base 6 of a printed board P, and the adhesive 2 is closely adhered to the copper coil 5 so as to make the patch 1 completely adhered. Then, a hole is bored from the patch 1 side using a drill 7, whereby the dislocation of the drill 7 is reduced to improve the leading, chips are put out on the patch 1 to improve the accuracy of the hole without damaging the copper foil 5, and a reduction in thickness of the patch is made possible to reduce the wear of the drill. In this case, the adhesion of the patches each other in stacking is prevented by using as the patch 1 is composite plate composed of a resin plate and a metal plate, or providing a released paper on the pressure sensitive adhesive 2 or a released coat on the other side of the patch 1.
申请公布号 JPH01210206(A) 申请公布日期 1989.08.23
申请号 JP19880033546 申请日期 1988.02.16
申请人 SAN ALUM KOGYO KK 发明人 GUNJI NORIO
分类号 B23B41/00;B23B35/00;H05K3/00 主分类号 B23B41/00
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