发明名称 APPARATUS AND METHOD FOR TEMPORARILY SEALING HOLES IN PRINTED CIRCUIT BOARDS
摘要 The apparatus comprises two major assemblies: a heater block assembly (28) and a vacuum table assembly (30). The heater block assembly employs a temperature controlled, insulated heater block (32) having a surrounding, movable vacuum collar (36). A flexible, thermally conductive vacuum skin (38) is mounted on the movable vacuum collar (36) and forms a vacuum chamber in cooperation with a movable vacuum table (42) having a flat, porous plate (44) whose upper surface is parallel to the vaccum table surface. A sandwich comprising a porous release sheet (64), the printed circuit board (66), a thermodeformable material (70) and a thermally conductive cover sheet (72) is positioned on the vacuum table flat, porous plate (44). Thereafter, the vacuum table (42) and sandwich are moved together so that the table forms a sealing relation with the flexible, thermally conductive vacuum skin (38). A vacuum is then drawn in the now formed vacuum chamber (74) forcing the flexible, thermally conductive vacuum skin (38) against the sandwich to compress the porous release sheet (64) between the printed circuit board (66) and the flat, porous plate (44). At this point, the flexible, thermally conductive vacuum skin (38), sandwich and vacuum table (42) are moved into a position in which the flexible, thermally conductive vacuum skin (38) is forced into thermally conductive contact with the heater block (32). Heat from the heater block softens the thermodeformable material (70) so that it deforms into the holes (68) of the printed circuit board (66) forming protectively sealing plugs (76) therein. After cooling, the vacuum table (42) is moved in the reverse direction to permit removal of the sandwich.
申请公布号 EP0269085(A3) 申请公布日期 1989.08.23
申请号 EP19870117393 申请日期 1987.11.25
申请人 MULTITEK CORPORATION 发明人 CHOINSKI, EDWARD J.
分类号 H05K3/06;H05K3/00;(IPC1-7):H05K3/00;H05K3/42 主分类号 H05K3/06
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