| 摘要 |
PURPOSE:To equalize temperature distribution in a semiconductor substrate, and to form a resin film in homogeneous uniform film thickness by making a central section lower than a peripheral section at the rate of contact areas with the semiconductor substrate of a substrate holding chuck. CONSTITUTION:A substrate holding chuck 4 covers two third or more of the area of a semiconductor substrate 3, and the central section of the semiconductor substrate 3 is made lower than the peripheral section at the area rate of the substrate contact surface of the semiconductor substrate 3 and the substrate holding chuck 4. Accordingly, the temperature of the semiconductor substrate 3 is equalized in a surface when a coating liquid is dried and film-formed by spinning of the semiconductor substrate 3, thus shaping a resin film in homogeneous uniform film thickness. |
