发明名称 |
Method of using electrically conductive composition |
摘要 |
An electrically conductive composition containing a photosensitive epoxy polymer, a reactive plasticizer, and electrically conductive spherical particles wherein the outer surfaces are of a material selected from the group of platinum, palladium and gold. The compositions are used to provide a flexible electrically conductive bond between a supporting substrate and a semiconductor.
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申请公布号 |
US4859268(A) |
申请公布日期 |
1989.08.22 |
申请号 |
US19880199875 |
申请日期 |
1988.05.27 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
JOSEPH, CHARLES A.;PETROZELLO, JAMES R. |
分类号 |
C04B26/14;H01B1/22;H05K3/32 |
主分类号 |
C04B26/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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