| 摘要 |
<p>PURPOSE:To constitute the title device so that a width of a cutting allowance can be narrowed and a larger number of collecting semiconductor chips can be obtained out of a semiconductor substrate, by a method wherein a groove of a fixed depth or deeper is formed by tracing a dividing line with a first rotary grinding wheel and almost the center of the foregoing groove is cut off with a second rotary grinding wheel whose width is narrower than that of the groove. CONSTITUTION:A semiconductor substrate 1 to the back of which a resin film 2 is stuck with an adhesive agent is positioned and fixed to a stage 5 of a dicing device. A first rotary grinding wheel 3a held by a grinding wheel holding fixture 4a is turned at, for example, about a number of revolutions of 3500rpm, the rotary grinding wheel 3a is lowered along a dividing line of the semiconductor board 1 and a groove 6 is formed on a line dividing a semiconductor chip while notching the semiconductor substrate 1 so that the groove of a depth of about 1/2-2/3 of a plank of the semiconductor substrate 1 is formed. Then the title device is constituted so that a second rotary grinding wheel 3b which has a narrower grinding wheel than that of the first rotary grinding wheel 3a and is held by a grinding wheel holding fixture 4b runs after about the center of the groove 6 and cutting is performed by forming a groove 7 while giving a notch so that the notch arrives at the resin film 2.</p> |
