发明名称 Semiconductor integrated circuit device
摘要 According to the present invention, an IC device includes an input PNP transistor, a first NPN transistor, a second NPN transistor and an SBD; and the device is characterized in that an isolation layer (16) is provided between the input PNP transistor (1) and the SBD (7); and in that the lead wires by which the emitter of the first NPN transistor (11) and the base of the second NPN transistor (9) are connected to the anode of the SBD (7) are shorter than the lead wire between the base of the input PNP transistor (1) and the cathode of the SBD (7).
申请公布号 US4860065(A) 申请公布日期 1989.08.22
申请号 US19860937119 申请日期 1986.12.02
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 KOYAMA, TSUNEHIRO
分类号 H01L27/082;H01L21/762;H01L21/8222;H01L23/522;H01L27/06;H01L27/07;H03K19/013 主分类号 H01L27/082
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