发明名称 POWER MODULE ELEMENT
摘要 PURPOSE:To remove an electrical exposure part outside and install elements outside the apparatus, by connecting wires, outer circumferences of which are insulated with insulation covering materials, with a plurality of semiconductor elements and by taking out the non-connected end side of the wires outside after coating the connected end side of these wires. CONSTITUTION:Transistors consisting of a plurality of semiconductor elements are coated with an insulation substance 2 and are shaped in the form of a plate. One end side of an input signal wire 13, an outer circumference of which is insulated, is connected with an input signal part of a plurality of transistors which are coated with the insulation substance 2 and the other end side of the input signal wire 13 is taken outside. One end side of a power wire 14, an outer circumference of which is insulated, is connected with a power terminal part of the transistors which are coated with the insulation substance 2 and the other end side of the power wire 14 is taken outside. As electrical exposure parts disappear in this way, a power module element 11 is incorporated outside the gastight apparatus 6.
申请公布号 JPH01207960(A) 申请公布日期 1989.08.21
申请号 JP19880031897 申请日期 1988.02.16
申请人 MITSUBISHI ELECTRIC CORP 发明人 NISHIZAWA YUJI
分类号 H01L23/34;H01L23/48 主分类号 H01L23/34
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