发明名称 FORMING DEVICE FOR UNEVEN PATTERN ON PLATELIKE SUBSTRATE
摘要 <p>PURPOSE:To enable an uneven pattern to be continuously formed, while resin layer is cured except the part covered with the uneven pattern and uncured resin is removed, by a method in which while a platelike substrate is transferred on a prescribed path, the shielding sheet with ionized radiation-shielding pattern is stuck to the substrate through the layer of ionized radiation curable resin, and ionized radiation is radiated through said shielding sheet. CONSTITUTION:A platelike substrate 1 is transferred by a conveyer 2, and the layer 13 of ionized radiation curable resin is formed on the platelike substrate 1 by a coating device 3. A shielding sheet 5 is stuck to the resin layer 13 by a press roll 9 so that air is not entrapped and a colorant layer 7 is brought in contact with the resin layer 13. The platelike substrate 1 passes the lower part of an ionized radiation-radiating device 10, and the resin layer 13 is irradiated with ionized radiation through the shielding sheet 5. Consequently, the part under a shielding pattern 8 is not cured, but the other part is cured and adheres to the substrate 1. A cutting device 11 cuts the shielding sheet 5 between the front and rear substrates 1, 1, and the substrate 1 is discharged in the state where the shielding sheet 5 is stuck to its surface. When the shielding sheet 5 is teared off, cured part remains on the substrate 1 and uncured part is removed.</p>
申请公布号 JPH01206046(A) 申请公布日期 1989.08.18
申请号 JP19880030150 申请日期 1988.02.12
申请人 DAINIPPON PRINTING CO LTD 发明人 GOTO HIDEO;TAKEATSU OSAMU;TANAKA HIROSHI
分类号 B32B43/00;B05D5/00;B32B33/00;B32B37/00 主分类号 B32B43/00
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