发明名称 POSITIONING DEVICE FOR SEMICONDUCTOR WAFER
摘要 <p>PURPOSE:To ensure the proper positioning of a semiconductor wafer by setting the predetermined size of a region corresponding to the size of an element pattern within a field of view as a sample picture image retrieval region to be compared with a reference picture image as a basis for computing a dislocation from an image pickup device. CONSTITUTION:An image pickup device 2 takes an element pattern and the picture image thereof is saved in the first memory means 3. Furthermore, the many valued data B of a sample picture image is read out and compared with a reference picture image in the second memory means 4 via a comparison means 5. A judgement means 6 discriminates a sample picture image as existing within the predetermined size region so determined as to correspond to the size of an element pattern in an element size memory means 1 preliminarily determined to a value within the field of the image pickup device 2, and nearest the many valued data C of a reference picture element. A relative displacement amount between the sample picture image and the image pickup device 2 is obtained with an operation means 7, and the dislocation amount is corrected with a position correction means 8. According to the aforesaid construction, it is possible to ensure proper relative position alignment between a machine system and a semiconductor wafer.</p>
申请公布号 JPH01205960(A) 申请公布日期 1989.08.18
申请号 JP19880031571 申请日期 1988.02.12
申请人 NITTO DENKO CORP 发明人 ISHIHARA AKIRA;KANEHARA MATSURO;SEKIDO TOSHIYUKI
分类号 B23Q17/24;H01L21/301;H01L21/68;H01L21/78 主分类号 B23Q17/24
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