| 摘要 |
PURPOSE:To simplify steps by covering the through hole of a first conductive thin film with a conductive layer, patterning the first and second conductive thin films to form first and second conductive patterns, and electrically connecting the predetermined parts of the patterns by the conductive layers in the hole. CONSTITUTION:A through hole 41h is made at a predetermined part at the first conductive thin film 41 of a board 32 covered with first and second conductive thin films 41, 42. Then, with the first thin film as a mask a through hole 31h is made in a board 31, through hole 51 of through holes 31h, 41h are formed in a state that the film 42 remains, and the hole 31h of the board 31 is covered with a conductive layer 34. Thereafter, the films 41, 42 are patterned to form first and second conductive patterns 61, 62. Thus, the patterns 61, 62 are electrically connected by the layer 34 to the predetermined parts. Thus, working steps can be simplified. |
