| 摘要 |
PURPOSE:To relieve stress externally exerted to a semiconductor pellet, by bonding a pellet body to a die bonding solder while providing a linear region where no metal layer is formed in the bonding interface between them. CONSTITUTION:In order to enable a pellet body 1 to be bonded to a die bonding solder 6 with enhanced adhesive force, a metal layer 2 is previously formed on the die bonding surface of the pellet body 1. This metal layer 2 is not formed all over the die bonding surface but an annular groove 3 without the metal layer is formed inside and along the periphery of the pellet body 1. When a semiconductor pellet is die bonded to a radiation plate 5 by means of the soldering material 6, a space is defined in the groove 3 where the metal layer 2 is not present. If external force is applied to the pellet after it is sealed with resin, dislocation is caused first in the radiation plate and the sealing resin enclosing the pellet, and then the force is applied to the layered structure itself on the radiation plate 5. Such external stress can be absorbed effectively because adhesion between the metal layer 2 and the soldering material 6 is broken by the groove 3.
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