| 摘要 |
PURPOSE:To enable a resin-sealed electronic device having improved heat dissipating properties to be produced easily at low cost, by injecting a first sealing resin having high heat conductivity into the cavity section below a support plate for forming there a resin layer having high heat dissipating properties, while forming a resin layer of a second sealing resin having low heat dissipating properties in the cavity section over the support plate. CONSTITUTION:Fluidized sealing resin is injected under pressure into a mold cavity 17 and solidified to form a resin-sealed body 8. The sections of the cavity over and below a support plate 2 are filled with different types of sealing resin. Namely, the cavity section below the support plate 2 is filled with a first sealing resin having higher heat conductivity while the section over the support plate 2 is filled with a second sealing resin which has lower heat conductivity, less expensive and wears less the mold than the first resin. Thus, the section below the support plate 2 is filled exclusively with the first sealing resin while the section over the support plate 2 is filled with the second sealing resin and a small amount of the first sealing resin. The first and second sealing resins injected into the mold cavity 17 are solidified rapidly to produce the resin-sealed body 8. |
