| 摘要 |
PURPOSE:To eliminate disconnection of upper wiring film of a wiring intersection by making the lower wiring film a laminated film which consists of a plurality of layers and by making the lower layer of the laminated film wider than the upper layer. CONSTITUTION:A lower wiring film 7, an interlayer insulation film 9 and an upper wiring film 8 are formed on a substrate 1. The lower wiring film 7 is a lamination film which consists of a primary layer 7a and a secondary layer 7b. For example, the primary layer 7a is a Cr film and the secondary layer 7b is an Al film. If the primary layer 7a is made wider than the secondary layer 7b, the upper wiring experiences step differences by one layer at the intersection with the upper wiring film 8. Since the step difference is small in this way, disconnection can be prevented. |
