IC PACKAGE WITH HEAT-DISSIPATING SHEET,申请号JP19880030387-传众专利搜索

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发明名称	IC PACKAGE WITH HEAT-DISSIPATING SHEET
摘要
申请公布号	JPH01205556(A)	申请公布日期	1989.08.17
申请号	JP19880030387	申请日期	1988.02.12
申请人	NEC KYUSHU LTD	发明人	HISUMI SEIJI
分类号	H01L23/29;H01L23/28;H01L23/36	主分类号	H01L23/29
代理机构		代理人
主权项
地址

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