| 摘要 |
PURPOSE:To simplify a process without reducing the area in which board circuit forming is possible by removing a squeeze-holding part of a terminal member within a range corresponding to a board connected to a lead terminal and hy soldering while squeeze-holding a holding part by means of a squeeze-holding part. CONSTITUTION:A board 26 to be connected with a lead terminal 80 is provided on its either side with holding parts 31. A lead frame 21 is connected commonly at its one end while the other end includes a plurality of terminal members with their squeeze-holding parts of the lead frame 21 corresponding to the board 20 being removed. The remaining squeeze-holding parts squeeze-hold the holding parts 31 of the board 26 to secure the board 26 and the lead frame 21 together. At this time, the other ends of the terminal members with their squeeze-holding parts removed are in contact with electrodes 27 for example formed at the board 28 and the other ends of the terminal members with their squeeze-holding parts removed and the board 26 are soldered together by simply dipping them into molten solder 28 or the like. This process makes it possible to solder the terminal members only on the one side of the board 26 while utilizing the other surface of the board effectively. |
