| 摘要 |
An apparatus for measuring the adhesion force of a thin film deposited on a substrate of a specimen. The apparatus comprises an inclining mechanism for mounting a sample dish with a specimen inclined by a predetermined angle with respect to the sample dish, an indentor disposed above the specimen for deforming the specimen by indentation, a driver for driving the indentor perpendicular to the sample dish, a load transducer for measuring a load applied to the specimen by the indentor, a sensor for sensing propagation of a crack produced in the specimen by the load, a displacement gage interlocked with the driver for measuring a penetration depth of the indentor, and a measuring mechanism for measuring the adhesion force of the thin film to the substrate.
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