| 摘要 |
PURPOSE:To solve the instability of bonding strength, which is caused by the ununiformity of the amount of deformation of a ball in multiple bonding to a single electrode, and to make it possible to execute always a stable bonding by a method wherein a wire bonding device is provided with a contact detecting device, a load device capable of giving a load and the amount of deformation, which are previously set, to the ball formed at the point of a conductive wire and so on. CONSTITUTION:A wire bonding device contrived so as to thermally fix by pressure a ball formed at the point of a conductive wire 13 on an electrode 16 by a capillary 1 or a bonding tool 2 is provided with A contact detecting device 9 capable of detecting a fact that the capillary 1 or the bonding tool 2, the ball and the electrode 16 are brought to a contact state early in thermocompression bonding, a load device capable of giving a load and the amount of deformation, which are previously set, to the ball from the above state and a control device 10 capable of turning-ON the above load device at the time of input of a contact signal from the above device 9. For example, the above load device is constituted of a swinging arm 3, a swinging cam 4, a cylinder 5, a spring 6, a pulse motor 7, a feed screw 8, a stopper 19 and so on. |
