发明名称 MANUFACTURE OF MULTILAYER CIRCUIT WIRING BOARD
摘要 PURPOSE:Not only to prevent patterns of layers from deviating from each other but also protect the patterns against the disconnection and a short circuit by a method wherein a conductive pattern is provided around a positioning reference hole and circuit wirings of layers are laminated as they are closely contacted with each other. CONSTITUTION:A conductive pattern 25 is provided around a positioning reference hole 22, and circuit wiring board 1 of layers are laminated as closely contacted with each other. For instance, a conductive pattern is provided onto not only a circuit wiring region 21 of each circuit wiring board 1 but also a periphery 23 of the reference hole 22 other than the circuit wiring region 21. The circuit wiring board 1 processed as mentioned above and a synthetic resin foil 2 are alternately laminated into two or more layers, and a reference pin 3 is inserted into the reference hole 22 to make the positioning of the circuit wiring boars with each other so as to form a laminated body 5. The laminated body 5 is mounted on a flat base as it is and wholly covered with a cover sheet form the upside, and then air is evacuated from the covered body 5, and the whole body 5 is heated as being pressed. Then, the heat and the pressure are released from the body 5, the lamination and the adhesion of the circuit wiring boards 1 of the laminated body 5 are completed to obtain a multilayer circuit wiring board, and the part other than the circuit wiring region 21 of the laminated body 5 is cut off to be removed.
申请公布号 JPH01199495(A) 申请公布日期 1989.08.10
申请号 JP19870332190 申请日期 1987.12.28
申请人 TOPPAN PRINTING CO LTD 发明人 FUKUGI KUNITSUNA
分类号 H05K3/46 主分类号 H05K3/46
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